Orbotech won $5 Million DI Solutions order for mobile devices
15 March, 2017
Leading Japanese electronics manufacturer installed Orbotech's DI solutions Nuvogo 1000R and Paragon Ultra Laser Direct Imaging, to improve its production line
A major Japanese electronics manufacturer with worldwide facilities, placed a $5 million order for Orbotech’s direct imaging (DI) solutions for solder mask and other solutions. The Orbotech solutions were adapted to meet the customer’s specific manufacturing requirements for smart mobile devices.
Following extensive testing in late 2016 and strong collaboration between Orbotech and its customer, Orbotech received an order for multiple direct imaging solutions to address the technological challenges involved in manufacturing next generation smart mobile devices. It includes the Paragon Ultra for complex IC substrates, and the Nuvogo 1000R, a large-format DI solution, that was also installed to enable high-quality DI for patterning and solder mask.
“Our customer had specific demands regarding production standards and specifications that presented unique challenges,” said Yair Alcobi, President of Orbotech Asia East. “Orbotech also succeeded in customizing features to satisfy the specific requirements of a number of advanced applications.”
Laser technology for smart production
Featuring Orbotech’s Large Scan Optics (LSO) Technology, Paragon Ultra Laser Direct Imaging (LDI) is used for complex IC substrate applications including Flip-Chip BGA, Flip-Chip CSP, BGA/CSP and modules manufacturing. It provides fast throughput using enhanced electronics and a powerful laser system on both conventional UV and LDI resists.
Nuvogo 1000R utilizes a high-power laser and unique MultiWave Laser Technology that provides flexibility on a wide range of materials and applications. It is a solution for flex patterning and solder mask applications that demand fine structures on variating topography.
Orbotech Ltd. from YAVNE, Israe, provides yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Orbotech’s annual revenues for 2016 were $806 million, up 7% compared with $753 million in 2015.