Autotalks to provide more than 1 Million C-V2X Chips for a new Chinese Car

The Israeli fabless Autotalks, announced that its chipset was selected for a mass production C-V2X program in China. Techtime has learned that the company will provide more than 1 million communication chipsets, to be embedded in the Telematics Control Unit (TCU) built by a top Tier-1 automotive provider. This is the biggest commercial design win of Autotalks, and one of the biggest connected car projects in China.

The unidentified Chinese car producer plans to build more than million connected cars, and to sell them in the local market. They will be able to connect with each other via the cellular networks, and wherever available, to connect with the local connected road infrastructures. The company said that the selection of its chipset for the project followed rigorous testing and evaluation that proved  it radio performance, security, thermal resiliency and transmit diversity.

It also followed a long process of adapting Autotalks’ products to the Chinese regulations, which was culminated in October 2019, when Autotalks successfully showcased its chipset’s conformance to the Chinese C-V2X standard and its OSCCA-compliant security requirements during interoperability demonstration in a multi-brand C-V2X environment.

This demo brought together 20 automotive companies, including leading automakers ,with 50 demonstration teams to examine how they are working together in a close-to-real-world setting. Autotalks’ C-V2X chipset was used by five different automakers: Renault-Nissan, Brilliance Auto, FAW, Great Wall and another major European OEM.

“This important win is a clear testimony to the trust that leading OEMs and Tiers put in Autotalks, as a global V2X chipset provider,” said Hagai Zyss, CEO of Autotalks. According to the research firm IHS Markit, China is expected to lead the global V2X market, with an estimated 629,000 light vehicles produced in the region equipped with C-V2X technology in 2020, and the country is expected to stay in the lead through 2024.

Comtech to Acquire Gilat for $532.5 Million

Comtech Telecommunications from New York announced an agreement to acquire Gilat Satellite Networks from Petah Tikva (near Tel Aviv) for approximately $532.5 million. This is a cash and stock transaction of which 70% will be paid in cash and 30% in Comtech common stock. Gilat provides satellite ground stations and in-flight connectivity solutions and services, based on its satellite networking technology.

Gilat is planned to become a wholly owned subsidiary of Comtech and will maintain its brand and its corporate headquarters and research and development facility in Petah Tikva, Israel under the leadership of Yona Ovadia, Gilat’s current CEO. No Comtech or Gilat facility locations are expected to be closed as a result of the transaction. Gilat expects to achieve 2019 annual sales of $260-$270 million. Comtech announced on December 2019 that it expects to achieve sales of $712-$732 million in 2019.

The combined companies would employ approximately 3,000 people and offer satellite technology, public safety and location technology and secure wireless solutions to commercial and government customers around the world. Fred Kornberg, Chairman of the Board and CEO of Comtech, said that The combination of accelerating satellite connectivity demand, and the increasing availability of low-cost satellite bandwidth, makes this a perfect time to unify Comtech and Gilat’s solutions. “Gilat is an exceptional business that has developed extraordinary technology and has a well-respected product portfolio supported by strong research and development capabilities.”

Gilat is well positioned to take part in the new Low Earth Orbit (LEO) Communications Satellite Constellations. Last November it achieved the fastest ever modem speeds of 1.2 Gbps total throughput over Telesat’s Phase 1 LEO satellite. This industry milestone demonstrates the potential of high throughput Non-Geostationary Orbit (NGSO) satellite constellations. The combination of high throughput provided by Gilat’s technology and the low latency from NGSO is considered essential for delay-sensitive applications such as 5G – which is a main target market of Comtech.

Fabrinet Builds a New Production Facility in Israel

Photo above: David Mitchell (left) and Yuval Maimon

The Global Electronic Manufacturing Services provider (EMS), Fabrinet, is entering Israel and is now in the final stages of building a new manufacturing facility in Yokneam, near Haifa. Fabrinet has invested approximately $6.5 million in preparing a complete production capabilities, ranging from SMT and Microelectronics, to Optics and Mechanical works.

Yuval Maimon, General Manager at Fabrinet Israel, told Techtime that Fabrint’s facility in Israel is the first in the country to provide Electronics, Microelectronics and Optics production services “under one roof”.  Yuval: “Until now customers needed to move their products between several different specialty production services. We bring new offer: total responsibility to all the aspects of production.”

The facility is planned to start working this month (January 2020). It includes also clean rooms for Optics and Microelectronics works and equipment for Active/Passive Alignment, Wire Bonding and Die Attach for up to minus 1 micron accuracy. For now, the production facility employs 15-20 employees.

Fabrinet expects that its facility in Israel will provide local NPI services (New Product Introduction), helping the customers with design for manufacturability, and then transferring those programs to Thailand for volume manufacturing.

Low-volume, High-mix Service Provider

Fabrinet was founded in 2000 by the current chairman, David T. (Tom) Mitchell, one of the co-founders of Seagate Technology, as a low-volume, high-mix service provider for the manufacturing of complex optical components. Today it provides advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers (OEMs) of complex products.

It is focused mainly on optical communication components, modules and sub-systems, industrial lasers, automotive components, medical devices and sensors. Fabrinet employ approximately 12,000 employees worldwide. Its major production is done in Thailand, with additional facilities in the UK and the US. Its total revenues for the fiscal year 2019 (ended in June, 2019) increased by 15.5% YoY to $1.58 billion, mainly as a result of a strong demand for optical communications products.

Digi-Key Brings Interactive Booth to Embedded World 2020

Digi-Key Electronics plans to have interactive and unique technical demonstrations in their booth area, as well as more traditional games and giveaways, during Embedded World 2020 on Feb. 25-27, 2020, in Nuremberg, Germany.The company is also an official sponsor of Student Day on Feb. 27, when 1,000 final-year engineering students from around the world will gather to meet potential employers.

Digi-Key’s demonstrations will feature Digi-Key’s IoT Studio, IoT sensor technology, infrared devices, board level solutions, value-added design tools and augmented reality. Some of the themes will include: Systems and solutions created by the Digi-Key applications engineering team, Project-based solutions that highlight how using the DK IoT Studio has evolved rapid prototyping with both ease and speed of design.

The company will demonstrate many types of solutions, from Scheme-it (Digi-Key’s back-of-the-napkin design editor) to KiCad (the leading open source EDA design environment). The company will show its customer assistance tools, including: TechForum (online community with a direct pipeline to its technical support team), eeWiki (a broad source of technical knowledge driven and supported by Digi-Key’s application engineering team), io (project-based solutions to help designers get a jump start on rapid prototyping) and 24/7 Telephone and chat support.

Visit Digi-Key at Embedded World in Hall 4A, booth 633.

To learn more about Embedded World: https://www.embedded-world.de/en.

Digi-Key Electronics, headquartered in Thief River Falls, Minn., USA, is an authorized global, full-service distributor of electronic components, offering more than 10 million products, with over 2.2 million in stock and available for immediate shipment, from over 800 quality name-brand manufacturers.

Digi-Key also offers a wide variety of online resources such as EDA and design tools, datasheets, reference designs, instructional articles and videos, multimedia libraries, and much more. Technical support is available 24/7 via email, phone and webchat. Additional information and access to Digi-Key’s broad product offering can be found by visiting www.digikey.com and on Facebook, Twitter, YouTube, Instagram, and LinkedIn.

 

New Concept for In-Vehicle Storage

Micron Technology and Valens from Hod Hasharon, near Tel Aviv, demonstrated the first automotive industry’s 1TB remote, centralized storage solution at the Consumer Electronics Show in Las Vegas. Based on Micron’s ball grid array (BGA) solid-state NVME drive and Valens’ automotive connectivity technology, the combined solution is capable of tunneling PCIe over long distances on a single cable supporting up to 16Gbps of data transfer over low-cost, unshielded twisted pair wiring (UTP).

“Remote, centralized storage provides significant benefits over traditional local, distributed storage in automotive applications,” said Reinhard Weigl, Micron’s senior director of Automotive Marketing at Micron. “It enables better data protection and version control at a lower cost.” Micron is using Valens’ automotive VA608A chipset that delivers data transmission speeds of up to 16Gbps and enables automakers to extend native PCIe as a long-distance in-vehicle connectivity technology – up to 15m/50ft.

The VA608A is also the only chipset to enable 2.5Gb Ethernet over UTP wire. It enables a new concept for long-distance PCIe connectivity, and to utilize existing components without requiring a complete redesign of the vehicle’s architecture. Valens’ PCIe extension technology is designed for many use cases in the vehicle including telematics, multi-modem antennas (5G, WiFi, WiGig, BT, etc.),  ECU-to-ECU connectivity, and shared storage/black box storage.

Valens was established in 2015 with a goal to provide the fastest audio/video chipset technology to the automotive. Its patented HDBaseT technology was adopted by The MIPI Alliance as the baseline for its long-reach, high-speed connectivity A-PHY automotive application standard.

60GHz In-car Automotive Grade Radar-on-chip

Vayyar Imaging from Yehud, near Tel aviv, announced the world’s first 60GHz automotive-grade MIMO radar-on-chip (ROC). The 60GHz solution offers the complete functionality of Vayyar’s leading 79GHz reference-design, enabling the automotive industry to meet global EU NCAP and US Hot-Car needs.

The new Radar displays the dimension, location, breathing pattern and movement of people, utilizing proprietary 4D point-cloud VOXEL imaging.  Vayyar’s automotive-grade radar-on-a-chip (ROC) has up to 48 transceivers and an internal DSP for real-time signal processing. It produces 2,000 virtual reference points of the surrounding.

With a board containing a multiple antennas on the PCB, the system builds its 4D Point Cloud, from which the software extracts the relevant  information about the scanned objects. The company said this is the first to close the gap between the robustness of radars and the resolution of LiDAR and optics.

It is ready for mass production and deployment, having undergone intensive CPD and SBR test cases over the last year, with millions of test-samples. “We are proud to offer a 60GHz version of our leading 79GHz chip, affording the industry complete regulatory flexibility,” said Ian Podkamien, Director of Automotive Business Development at Vayyar.

“Our comprehensive In-Car Evaluation Kit is available on both 60GHz and 79GHz versions, with the same software.”

Exclusive: Intel builds an Israeli team to develop SmartNICs

The Data Center Group of Intel Corp. is building a new development team to develop SmartNIC boards for high capacity Data centers and  Cloud Infrastructures. Techtime has learned from sources in Intel Israel, that the new group is in its initial phase of buildup, and is planned to operate from Intel’s developments centers in Haifa and Jerusalem.

The main competitor of the future Intel SmartNICs is expected to be Mellanox Technologies, located in Yoqneam, near Haifa. According to unconfirmed reports, Intel had made a bid to acquire Mellanox, but failed: On March 11, 2019 NVIDIA and Mellanox have reached a definitive agreement under which NVIDIA will acquire Mellanox for $6.9 Billion.

SmartNICs are the new generation of Network Interface Cards (NICs). Originally, a NIC is an adapter that connect each server to the local Ethernet network. SmartNIC adds computational capabilities to the NIC, in order to offload tasks from the system CPU. Using its on-board processors (implemented in ASIC, FPGA or System-on-a-Chip),  the SmartNIC performs tasks usually handled by the CPU, such as encryption, decryption, firewall, TCP/IP and HTTP processing. SmartNICs are ideally suited for high-traffic Web servers and Hyperscale Clouds.

“Significant Impact on the Next Generation Network”

SmartNICs are important to support Intel’s stronghold in the Data Centers market. While it is still unclear what is Intel’s road map for its future SmartNICs, a few days ago it has started to look for a lead performance architect for advanced SmartNIC products. “The performance architect will be responsible for a global view of product performance including defining requirements, projections to guide architecture decisions, modeling and simulation.

“The candidate is expected to guide a small team towards architecture trade-off analysis and a high quality performance engineering process. This is a new project in DCG’s Connectivity Group with opportunities to have a significant impact on next generation network components and large scale data center systems,” Intel stated.