New Concept for In-Vehicle Storage

Micron Technology and Valens from Hod Hasharon, near Tel Aviv, demonstrated the first automotive industry’s 1TB remote, centralized storage solution at the Consumer Electronics Show in Las Vegas. Based on Micron’s ball grid array (BGA) solid-state NVME drive and Valens’ automotive connectivity technology, the combined solution is capable of tunneling PCIe over long distances on a single cable supporting up to 16Gbps of data transfer over low-cost, unshielded twisted pair wiring (UTP).

“Remote, centralized storage provides significant benefits over traditional local, distributed storage in automotive applications,” said Reinhard Weigl, Micron’s senior director of Automotive Marketing at Micron. “It enables better data protection and version control at a lower cost.” Micron is using Valens’ automotive VA608A chipset that delivers data transmission speeds of up to 16Gbps and enables automakers to extend native PCIe as a long-distance in-vehicle connectivity technology – up to 15m/50ft.

The VA608A is also the only chipset to enable 2.5Gb Ethernet over UTP wire. It enables a new concept for long-distance PCIe connectivity, and to utilize existing components without requiring a complete redesign of the vehicle’s architecture. Valens’ PCIe extension technology is designed for many use cases in the vehicle including telematics, multi-modem antennas (5G, WiFi, WiGig, BT, etc.),  ECU-to-ECU connectivity, and shared storage/black box storage.

Valens was established in 2015 with a goal to provide the fastest audio/video chipset technology to the automotive. Its patented HDBaseT technology was adopted by The MIPI Alliance as the baseline for its long-reach, high-speed connectivity A-PHY automotive application standard.

Linse Capital and Oppenheimer Invested $63M in Valens

In-car communication get extra fuel with the $63 million investment of Linse Capital and Oppenheimer Asset Management in Valens, the developer of HDBaseT high speed communication technology for the audiovisual and automotive markets. The company is looking to accelerate the development of its portfolio for the autonomous vehicles and address the ongoing requirements of its automotive partners.

Valens’ HDBaseT Automotive chipsets enable the transmission of high-throughput, time-sensitive applications over an HDBaseT Automotive link, revolutionizing in-vehicle connectivity. The Valens Automotive chipsets bring the convergence of audio & video, Ethernet, USB, controls and power over a single unshielded twisted pair cable. In June 2017 it announced the VA6000 HDBaseT Automotive integrated circuit. The VA6000 enables symmetric tunneling of multimedia content, with a speed of up to 6Gbps over a single unshielded twisted pair (UTP) cable for up to 15 meters.

Since its latest funding in 2017, Valens, with strategic partnerships with leading OEMs and tier-1s, has identified significant opportunities in the autonomous sector. By raising additional capital, the company will be ramping up its activities in the sector, addressing in-vehicle high-performance computing, smart architectures and PCIe transmission, to realize the vision of the autonomous car.

ADAS System connected via HDBaseT Automotive communication chipset
ADAS System connected via HDBaseT Automotive communication chipset

“The autonomous and connected vehicles that automakers are designing today depend on advanced chipsets to enable high-speed data transmission, said Dror Jerushalmi, CEO and Co-Founder of Valens. “Our technology is leading the pack, optimizing in-vehicle connectivity to handle increased bandwidth with less complexity.” According to Michael Linse, Managing Director at Linse Capital, “Valens’ technology is ahead of its time and will revolutionize how car manufacturers design and deliver the autonomous and connected car of the future.”.”

“Oppenheimer recognizes that the rapid technological evolution happening in the automotive industry requires high-speed connectivity. Investing in Valens allows Oppenheimer’s clients to participate in that evolution,” said Robin Graham, Head of Technology Investment Banking at Oppenheimer. “We believe Valens’ technology will enable the automotive industry to meet the increasingly stringent design requirements of advanced connectivity and autonomous driving.”

HDBaseT Automotive chip technology enables unparalleled in-vehicle connectivity, converging audio & video, Ethernet, USB, controls, PCIe, and power over a single cable. This patented technology is used by the world’s largest audio/video component manufacturers and is promoted by the HDBaseT Alliance. Since its founding in 2010 by LG Electronics, Samsung Electronics, Sony Pictures Entertainment, and Valens, the Alliance has brought together the leading names in the consumer electronics, professional AV, industrial and automotive sectors, and it counts today with more than 200 members and thousands of products.