SPTS Technologies and Fraunhofer IZM Develops Wafer Level Packaging
15 January, 2015
For the joint development project, Fraunhofer IZM is using SPTS' Rapier process module to etch a range of silicon features, such as deep cavities and tapered or vertical TSVs with high aspect ratios
For the joint development project, Fraunhofer IZM is using SPTS’ Rapier process module to etch a range of silicon features, such as deep cavities and tapered or vertical TSVs with high aspect ratios
SPTS Technologies, an Orbotech company, is collaborating with Fraunhofer IZM, on the next generation wafer level packaging of microelectronic devices. “To meet the technical requirements of future microelectronic products, 3D-IC architectures using through silicon vias (TSVs) are being employed to overcome scaling limits while delivering better device performance,” stated Kevin Crofton, President of SPTS Technologies and Corporate VP at Orbotech.
For the joint development project, Fraunhofer IZM is using SPTS’ Rapier process module to etch a range of silicon features, such as deep cavities and tapered or vertical TSVs with high aspect ratios.
Martin Wilke, the expert in plasma etching at Fraunhofer IZM, commented, “Our researchers and customers expect us to use the latest state-of-the-art equipment. The SPTS Versalis fxP system was selected for our cleanroom facility in Berlin as it combines industry leading DRIE and CVD modules on a single platform, with the option to add additional modules as our capacity demands increase. The multi-technology Versalis fxP allowed us to reduce initial capital outlay and therefore cost of ownership, within a small footprint.”
With the APM CVD chamber, Fraunhofer IZM is benefiting from SPTS’ ability to deposit PECVD SiN/SiO film stacks at <190 degrees C with tunable stress, low electrical leakage and excellent diffusion barrier performance. Both technologies are on the single Versalis fxP platform, saving capex and valuable floor space. The ability to run multiple process recipes inside the same system gives Fraunhofer IZM significant flexibility: a valuable resource when working with clients from diverse sectors including automotive, healthcare and industrial electronics.
SPTS Technologies designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. It operates manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California.
Orbotech from Yavne, Israel, is a provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device is produced using Orbotech technology. For more information, visit http://www.orbotech.com/
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