UMC will develop 28nm process for Kilopass NVM Technology
29 May, 2013
The companies will port Kilopass non volatile memory IP to UMC’s 28nm processes: the High-K Metal Gate 28HPM for portable device system on chip (SoC) manufacturers, and the poly gate 28HLP for consumer electronics SoC designers
NVM antifuse technology can be embedded in standard CMOS process with no additional processing steps
Kilopass Technology and United Microelectronics (UMC), announced a technology development agreement. The companies will port Kilopass non volatile memory (NVM) Intellectual property (IP) to UMC’s 28nm processes: the High-K Metal Gate 28HPM for portable device SoC manufacturers, and the poly gate 28HLP for consumer electronics SoC’s.
The 28HLP Poly/SiON process provides a selection of voltage options for SoCs: 1.8v, 2.5V, and 2.5/ 3.3V. The 28HPM High-k/metal gate process provides options for device voltages, memory bit-cells and underdrive/overdrive capabilities to improve performance and battery life.
“We are happy to continue our partnership with Kilopass to ensure that their variety of anti-fuse NVM IP offerings is available on our 28nm process family,” said S.C. Chien, VP of Customer Engineering & IP Support at UMC.
The initial Kilopass-UMC partnership started in 2010 with UMC’s 40LP process, which is available now. During 2012 Kilopass-UMC accomplished the embedding of anti-fuse embedded NVM as an off-the-shelf product at 130/110/55nm processes. This latest agreement expands the relationship into the 28nm process node.
Kilopass Technology from Santa Clara, California, has invented NVM antifuse technology that can be embedded in standard CMOS process with no additional processing steps. With its technology, standard logic CMOS processes can deliver one-time programmable (OTP) and many-time programmable (MTP) memories.
UMC is a global semiconductor foundry based in Taiwan, with 10 wafer manufacturing facilities. The company employs over 13,000 people worldwide. Its main competitors are TSMC and GlobalFoundries.