Above: Camtek’s newly announced Eagle G5 inspection system

Camtek announced that it has received over $50 million in initial orders from several customers for its new Hawk product, with additional orders in the pipeline. These orders will be delivered throughout 2025. The Hawk, based on a new platform, addresses high-end Advanced Packaging technologies including capabilities for inspection and 3D measurements of wafers with 500 million micro bumps and Hybrid Bonding technology.

The Hawk will be officially launched in February 2025 at Semicon Korea. It addresses very demanding applications, including High Bandwidth Memory (HBM), Chiplet and Hybrid Bonding. At the same time, Camtek has also received initial Orders totaling $20 Million for its other newly launched product – the Eagle G5. The orders will be used primarily for 2D inspection of Advanced Packaging Fan-out applications.

Rafi Amit, Camtek’s CEO, said that Eagle G5,  “is the first of several breakthrough systems we plan to introduce in the coming months.” Eagle G5 is an for automated optical Inspection and Metrology system of semiconductor wafers, targeted for use for in the production lines of advanced packaging devices in applications such as HPC (high-performance computing), CIS (CMOS image sensors), SiC (Silicon Carbide), and others.

During the third quarter of 2024, Camtek has achieved record revenues of $112.3 million, a 40% year-over-year (YoY) increase. The company expexts $115 million sales in Q4, which would represent a 30% increase over revenues in Q4 2023. ” Given our guidance, 2024 is expected to be a record year for Camtek with revenue around $427 million, which would represent 35% growth YoY.”