Orbotech Won $18 Million Order for PCB Inspection
21 March, 2013
The orders are expected to include multiple Paragon Laser Direct Imaging and automated Optical Inspection Systems
Orbotech has signed major frame agreements, totaling approximately $18 million with two leading Printed Circuit Board makers in Taiwan and China for the mass production of high density interconnect PCBs.
The orders are expected to include multiple Paragon Laser Direct Imaging and automated Optical Inspection Systems, as well as related digital production tools. The company said it reflect an increasing level of capital investment by PCB customers in manufacturing advanced PCBs for highly sophisticated electronic devices.
“PCB manufacturers are coming to realize that the significant challenges involved in the mass production of high quality, ultra-thin and increasingly complex boards can now only be met by the use of systems having LDI capabilities,” said Richard Klapholz, Corporate Executive Vice President of Electronics Business at Orbotech. “The highly competitive nature of the advanced micro manufacturing segment requires continuous development of new production techniques that can keep pace with the rapid advances in electronics innovation.”