The Chinese Maxscend Technologies Chose CEVA DSPs for IoT Devices
27 August, 2014
Aviv Malinovitch, vice president and general manager of CEVA's Connectivity business: "Maxscend has a strong track record in China, a key market for CEVA"
Aviv Malinovitch, vice president and general manager of CEVA’s Connectivity business: “Maxscend has a strong track record in China, a key market for CEVA”
Maxscend Technologies from JiangSu, China, has joined the CEVAnet partner program of the licencor of DSP-based IP platforms, CEVA from Herzliya, Israel. The companies will offer solutions for Wi-Fi, Bluetooth and Bluetooth Low Energy (BLE), consisting of Maxscend RF IPs and CEVA’s connectivity platforms. The future products will target the markets of mobile and wearable devices, and the Internet of Things (IoT).
Aviv Malinovitch, vice president and general manager of CEVA’s Connectivity business unit said: “Maxscend has a strong track record in developing RF IP and has managed to achieve excellent market traction, especially in China, a key market for CEVA.”
“We are delighted to partner with CEVA,” said Zhihan Xu, CEO of Maxscend. “Our combo RF IPs (Bluetooth Smart, Smart-Ready and Wi-Fi/Bluetooth ) are an excellent complementary fit with CEVA’s Wireless Connectivity IP platforms and we look forward to further expanding our joint customer base.”
CEVA provides software and hardware IP packages for Wi-Fi and Bluetooth. Maxscend’s Connectivity provides RF IP portfolio available on a number of process nodes including SMIC 55nm and UMC 55nm and 110nm and may be ported to alternatives based on customer requirements.
Maxscend Technologies is headquartered in JiangSu, with R&D centers located in Zhang Jiang High-tech Park, Shanghai and in Shenzhen.