BW Robotics integrates Hailo chip in its AD kits 

Blue-White Robotics (BWR) incorporated into its next generation of its agricultural autonomous driving kit, planned to launch in the coming months, Hailo’s AI microprocessor, designed to accelerate embedded AI applications on edge devices – says BWR’s CTO and co-founder Aviram Shmueli in a conversation with Techtime. BWR’s kit is designed to transform agricultural vehicles such as tractors into self-driving machines.  

“This is the first time for an accelerator microprocessor to be integrated within an agricultural tool. Integrating the AI component makes it possible for us to overcome major limitations”. Integrated in the vehicle’s main computer, combined with a CPU and a GPU, Hailo’s chip will assist in performing processing tasks related to the sensors’ data and decision making, based on BWR’s proprietary models. “We’ve developed a significant AI layer. In order to achieve the desired level of autonomy, we combine neural networks and machine-vision in a magnitude that requires high computational capability at real time”. 

Hailo have developed its neural networks Hailo-8 processor in a unique architecture which features processing power of up to 26 tera-operations per second (TOPS), with a typical power consumption of only 2.5W. The chip is capable of analyzing the particular task, mapping the required resources for each processing layer and to allocate them as necessary. This way the device accelerates the processing task and reduces power consumption.  

Shmueli: “Conventional processors produce significant amount of heat, and we need to  remember that these agricultural tools operate in relatively hot locations. Hailo’s chip features an excellent ratio of computational power per watt, which reduces the load. In order to achieve maximal computation capabilities, processing tasks are divided between the central & graphic processors and the acceleration card”.  

Blue-White Robotics was founded in 2017 by Ben Alfi, Yair Shachar and Aviram Shmueli. It has raised a total of $50 million, in a round led by Insight Partners and Entrée Capital.

Aviram Smueli

The automation kit developed by the company includes a package of LIDAR sensors, optical cameras, management software for detection and avoidance of obstacles, a pressure-sensitive front bumper to prevent vegetation damages, and it also equipped with emergency mechanisms and remote control capabilities. Using Artificial Intelligence, the tractor “learns” the land and available routs. Incorporating the kit in the tractor makes it possible for the vehicle to perform, autonomously or remotely controlled, a variety of operation such as sprays, harvesting, disking, and seeding.

Shmueli explains that autonomous field driving might be more challenging than one may  describe. “Agricultural field is constantly changing, during the day and during the year, not to mention that this is a hybrid environment alongside human beings. This is why  it is impossible to base field driving on a predetermined mapping. In addition, just like military vehicles, agricultural tools operate in harsh terrain conditions such as vibrations, high temperatures and moisture, and this is why computation units must be ruggedized”. 

Avnet’s EBV Elektronik will distribute Hailo’s AI solutions in Europe and Israel

EBV Elektronik, an Avnet company (NASDAQ: AVT), today announced the signing of a new distribution franchise agreement for the EMEA region with Hailo, a leading edge Artificial Intelligence (AI) chipmaker.

Hailo offers a wide range of AI accelerators including the innovative Hailo-8™ AI processor and its M.2 and Mini PCIe high-performance AI acceleration modules. The Hailo-8, featuring up to 26 Tera Operations Per Second (TOPS) at a typical power consumption of 2.5 W, delivers superior edge performance with industry-leading power efficiency and enables edge devices to run sophisticated deep-learning applications at scale.

Hailo’s solutions connect to board-level platforms via the PCIe interface. This allows for high-performance and power-efficient AI solutions when used together with the Intel/AMD x86 or the Raspberry Pi Compute Module 4, as well as with ARM-based processors, such as those manufactured by NXP Semiconductors, STMicroelectronics, and Renesas. Another key product leveraging the advantages of Hailo’s AI technology is the MicroSys Electronics miriac® AIP-S32G274A embedded SoM (system-on-module), which is based on NXP processors and includes support for the Hailo-8 AI acceleration modules.

“This agreement with EBV is a major opportunity for our AI technology to gain greater penetration across Europe and beyond, in a range of markets including industry 4.0, automotive, smart retail, smart cities, and smart home applications,” said Orr Danon, CEO of Hailo

“Hailo’s technology is at the cutting edge of AI and deep learning applications,” said Susanne Betting, Senior Director Supplier Marketing at EBV Elektronik. “It is a major complement to our existing portfolio of AI solutions as a companion device for a range of microprocessors from our leading silicon suppliers and will significantly extend our options to deliver a range of world-class AI solutions to our customers.”

NEXCOM Partners with Hailo to Launch Next-Generation Vehicular Telematics Solution

The israeli chipmaker Hailo announced its partnership with NEXCOM, the industrial computer hardware manufacturer, to launch NEXCOM’s VTC 1021, their next-generation AI vehicular telematics solution. NEXCOM’s AI solution features the compact Hailo-8 AI accelerator module, enabling high performance and empowering in-vehicle computers to run intensive AI applications more efficiently.

NEXCOM and Hailo’s joint solution facilitates operational efficiency in public transit and fleet management, including enhanced capabilities such as ADAS (Advanced Driver Assistance Systems). Hailo stated that the in-vehicle solution’s compact, fanless design fits perfectly in cabins with limited space and is designed to withstand demanding automotive conditions, helping bring public transit vehicles and fleets into the smart era. The in-vehicle computer VTC 1021 powered by the Intel Atom x5-E3940 processor is also versatile, with the flexibility to power a variety of telematics applications such as infotainment, fleet management, ANPR, and mobile video surveillance. Among the target applications for the joint solution: driver drowsiness detection, occupant monitoring, pedestrian detection warning, collision avoidance warning, and more

“The future of the automotive industry holds endless promise for safety and comfort, but to achieve this, in-vehicle compute platforms must overcome significant technological hurdles,” said Liran Bar, VP Business Development of Hailo. “Scaling AI to meet these challenges requires ultra-high performance and flexible solutions, which our joint offering provides. With NEXCOM, we will leverage the power of AI to turbocharge the aftermarket platform’s compute power, thus making vehicles safer.”

“Our partnership with Hailo allows us to offer our customers advanced AI solutions which can power sectors such as public transportation and fleet management with more scalable, better-performing solutions,” said Jay Liu, Vice President at NEXCOM. “Our joint platform provides vehicles enhanced capabilities, including state-of-the-art applications which can vastly improve the driving experience as well as safety, ushering in a new era of smart transportation.”

Hailo’s specialized Hailo-8™ AI acceleration modules deliver unprecedented performance to edge devices. The modules are built with an innovative architecture that enables edge devices to run sophisticated deep learning applications that could previously only run on the cloud. Their advanced structure translates into higher performance, lower power, and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge.

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NXP and Hailo Expand AI cooperation through MicroSys

NXP Semiconductors and Hailo announced a cooperation to provide joint AI solutions for automotive Electronic Control Units (ECUs). The new solutions will combine NXP’s automotive processors S32G and Layerscape, along with Hailo-8 processor. Hailo-8 is an AI processor for edge computing with up to 26 tera-operations per second (TOPS) at a typical power consumption of 2.5 W. The solutions offer an open software ecosystem for applications and software stacks.

The first solution, powered by the Arm based NXP S32G processor combined with up to two Hailo-8™ AI processors delivering up to 52 TOPS. The second solution, powered by the Arm based NXP Layerscape platform and combined with up to 6 Hailo-8 processors, delivers a high-performance of up to 156 TOPS. “We are excited to partner with a major player like NXP to demonstrate the true potential of AI for automotive,” said Orr Danon, CEO of Hailo.

“We look forward to continuing to work with NXP to expand our edge processing solutions to a broad range of demanding applications including industrial & heavy machinery, robotics, and more.” The NXP-Hailo joint solutions are already being utilized by customers, including MOTER Technologies, which is using the Arm-based NXP S32G processor combined with a Hailo-8 M.2 AI accelerator module for Usage-Based Insurance (UBI) applications.

The evaluation boards were designed and produced by the Germany-based MicroSys, who cooperates with NXP as well as with Hailo. The miriac® AIP-S32G274A and miriac® AIP-LX2160A NXP-Hailo automotive based application-ready platforms are available from MicroSys, as well as development platforms by NXP: BlueBox 3.0 (Layerscape LX2160A and S32G and GoldBox (S32G). Both are compatible with Hailo-8™ M.2 AI Acceleration Modules.

Hailo Partners with KAGA FEI America to Support Growing Customer Base

AI chipmaker Hailo has partnered with KAGA FEI America, Inc. (KFAI), a leading global semiconductor distributor, to promote and support Hailo’s products in North America. According to a statement by the two companies, KFAI will enable Hailo to extend its reach to more customers across the region, impacting sectors such as smart retail, smart cities, smart homes, industry 4.0, and beyond.

The Hailo-8 AI chip delivers unprecedented performance to edge devices. Featuring up to 26 Tera Operations Per Second (TOPS), the module is built with an innovative architecture that enables edge devices to run sophisticated Deep Learning applications that could previously only run on the cloud. Hailo-8’s advanced structure translates into higher performance, lower power, and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge.

“KAGA FEI’s logistical expertise will significantly strengthen our presence in North America, where demand for Edge AI solutions continues to rise,” said Orr Danon, CEO of Hailo. “We are confident that KAGA FEI’s distribution channels and strong relations with customers will accelerate our expansion in the region. Our unique edge processing and acceleration solutions are a gamechanger for enterprises in many industries, and KAGA FEI will help us with customers both old and new in need of robust AI solutions at the edge.”

The agreement aims to helps Hailo strengthen partnerships with existing customers in North America, while enhancing its sales channels to expand into other markets. Hailo will continue offering its product line to customers.

“We are excited to partner with a top artificial intelligence company in the edge space like Hailo, as we see huge potential for their innovative AI solutions,” said Toyohisa Hoshino, President and CEO of KFAI. “Our experience in guiding customers in new technology adoption and demand creation, coupled with Hailo’s powerful AI solutions, will bring significant value to customers across the region.”

AI Chipmaker Hailo Partners with Macnica in Japan

Top Artificial Intelligence (AI) chipmaker Hailo has partnered with Macnica, a leading global semiconductor distributor, to sell Hailo’s products in Japan. The agreement with Macnica will allow Hailo to expand its presence in Japan, extending its reach to customers in fields such as smart retail, smart cities, smart homes, industry 4.0, and beyond.

The agreement is part of Hailo’s strategy to strengthen partnerships with existing customers in Japan, while expanding further into other Asia-Pacific markets to enable companies from a wide array of industries to accelerate AI computing performance at the edge. Hailo will continue to offer its innovative product line to customers in the region, including its specialized AI processor for edge devices, the Hailo-8™, as well as its M.2 and Mini PCIe high-performance AI acceleration modules.

“Working with Macnica will significantly strengthen our presence in the Asia-Pacific region, where interest in Edge AI solutions continues to rise,” said Orr Danon, CEO of Hailo. “This comes with growing demand from Japanese customers as they seek to empower their devices with AI capabilities at the edge. We were impressed by Macnica’s mission statement, as well as their strong relationship with customers, and we are confident that with our collaboration, we will further expand our offerings in the region.”

“We are excited to work with a leading company like Hailo, as we see the vast potential of their innovative AI solutions at the edge,” said Yusuke Kobayashi, Macnica Altima company president. “Our deep experience supplying semiconductors and other innovative technologies to this key market, combined with Hailo’s state-of-the-art AI products and team’s capabilities, will bring significant value to customers in Japan.”

The partnership follows the establishment of Hailo Japan G.K., Hailo’s wholly owned subsidiary located in Tokyo, led by former Sony executive Hiro Uchida.

The Hailo-8™ delivers unprecedented performance to edge devices. Featuring up to 26 Tera Operations Per Second (TOPS), the module is built with an innovative architecture that enables edge devices to run sophisticated deep learning applications that could previously only run on the cloud. Hailo-8’s advanced structure translates into higher performance, lower power, and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge

Lanner Electronics to embed Hailo’s AI Chip

AI (Artificial Intelligence) chipmaker Hailo announced today its partnership with Lanner Electronics, a global leader in the design and manufacturing of intelligent edge computing appliances, to launch groundbreaking AI inference solutions for real-time computer vision at the edge. Hailo has combined its Hailo-8™ AI acceleration module with Lanner’s edge computing boxes to create high-performance, compact devices to support the demands of emerging AI applications at the edge.

Smart cities, retail, and industrial operations require hundreds of cameras generating video streams that need to be processed locally, quickly, and efficiently with minimal latency. Scaling AI to meet this challenge requires ultra-high performance and easy to deploy solutions, which this joint offering provides.

Lanner’s LEC-2290 edge box pairs an x86 CPU with the Hailo-8 AI module to produce a solution capable of optimizing demanding edge workloads and accelerating time-to-market for AI deployments. Lanner’s low-footprint LEC-7242 industrial wireless gateway integrates the Hailo-8 into a fanless, efficient appliance for real-time applications powered by AI at the edge. Both solutions process multiple video streams in real-time on a single device, while securely transmitting curated metadata and insights with robust onboard network connectivity.

Lanner’s modular approach to network appliances provides a clear path for engineers looking to optimize neural processing workloads. Integrated with Hailo’s AI module, Lanner’s fanless Edge AI computers enable mission-critical applications such as video analytics, traffic management, access control, and beyond.

“Our expertise in creating effective purpose-built hardware platforms, combined with Hailo’s unparalleled AI module performance, will provide industries with a reliable vision-based solution that is low power, low latency and cost-effective,” said Geoffrey Egger, VP and GM of Lanner Intelligent Edge BU. “We are confident that together, our vision inference solutions will enable industries ranging from smart retail to smart cities to push computing to the edge.”

Hailo’s specialized Hailo-8™ AI acceleration module delivers unprecedented performance to edge devices. Featuring up to 26 Tera Operations Per Second (TOPS), the module is built with an innovative architecture that enables edge devices to run sophisticated deep learning applications that could previously only run on the cloud. Its advanced structure translates into higher performance, lower power, and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge.

“Lanner’s hardware platforms bring proven reliability, with a purpose-built design that can withstand the distinct challenges of the industrial edge. Combined with the Hailo-8 AI module, the joint solution provides unmatched AI performance that is more powerful, scalable, and cost-efficient than competing solutions,” said Orr Danon, CEO and Co-Founder of Hailo. “We look forward to seeing the positive impact that our collaborative platform will have on rapidly evolving sectors including smart cities, smart retail, industrial IoT, and beyond.”