Rockchip and CEVA won LG Design for 3D Camera
17 October, 2017
On August 2016, Rockchip has licensed the CEVA-XM4 imaging and vision DSP to enhance the imaging and computer vision capabilities of its SoC product lines. With LG design win, the cooperation between CEVA and Rockchip is becoming an alliance
Apple will no longer be alone in the market of 3D camera for face authentication and gesture recognition in smartphones: CEVA and LG Electronics announced today a partnership to deliver high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications. The 3D camera module incorporates the RK1608 coprocessor of the Chineze fabless Rockchip with multiple CEVA-XM4 imaging and vision DSPs.
The camera 3D sensing applications include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection and AR and VR. CEVA said that teams from CEVA, Rockchip and LG worked closely together to optimize LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimized algorithm libraries to ensure optimal performance under stringent power constraints.
“There is a clear demand for cost-efficient 3D camera sensor modules to enable an enriched user experience for smartphones, AR and VR devices and to provide a robust localization and mapping (SLAM) solution for robots and autonomous cars,” said Shin Yun-sup, principal engineer at LG Electronics.
The new “Power Couple”
Rockchip is an interesting partner in this project. In fact, it stands behind many new wins of CEVA’s imaging technology. Rockchip is considered China’s leading fabless semiconductor company and has been honored with China Chip Awards for 10 times. It was founded in 2001 in Fuzhou, and employ around 700 employees. Rockchip offers SoC (System-on-Chip) for tablets, notebooks, IPTV/OTT-Boxes, intelligent video applications in smartphones, drones, robotics and other smart devices.
On August 2016 Rockchip has licensed the CEVA-XM4 imaging and vision DSP to enhance the imaging and computer vision capabilities of its System-on-Chip (SoC) product lines. On March 2017 they saw the first fruit: The new generation of Asus Zenfone camera for smartphones came to market equipped with RockChip RK1608 processor and powered by CEVA-XM4 DSPs. On June 2017, Evomotion Technology announced it ROD-1/360°/720° dual-lens spherical camera. The ROD-1 is capable of taking 3k resolution 30fps videos and 4k resolution photos with panoramic stitching in real-time. It is based on CEVA-XM4 and Rockchip.
Less than a week later, PiSoft unveiled a 360 degree cameras, based on Rockchip’s RV1108 CEVA-XM4 imaging engine. The company said that compared to implementing their algorithms on CPU, the CEVA-XM4 was 36x more efficient for distortion correction and 60x more efficient for stitching. The latest design win with LG shows that the cooperation between CEVA and Rockchip is becoming an alliance.
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