Avnet ASIC selected to become a Value Chain Aggregator by TSMC

Avnet ASIC Israel Ltd, (AAI) a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica, an Avnet company (NASDAQ: AVT), has been appointed as a Value Chain Aggregator (VCA) by TSMC, the world’s leading silicon foundry. The appointment positions Avnet ASIC Israel Ltd as a channel for TSMC ASIC customers, offering a full turnkey solution from design inception to layout and mass production, implemented in TSMC’s most advanced silicon processes.

The collaboration signifies a landmark agreement within Avnet, enhancing the offerings by combining the strong technology of TSMC with the ASIC design and manufacturing capabilities of Avnet ASIC. This best-of-class initiative enables access to TSMC’s most advanced silicon processes for customers, establishing Avnet ASIC as a channel partner of TSMC for comprehensive ASIC SoC solutions.

“We are pleased to welcome Avnet ASIC Israel Ltd. as a VCA to TSMC’s offering. Their outstanding track record with TSMC’s technologies and expertise in design, production, and diverse applications such as automotive and AI, is valuable to us, and is an instrument to bring exceptional value to our customers and help expand our market “, said Paul de Bot, General Manager of TSMC EMEA.

TSMC’s VCA program is designed to extend TSMC’s reach, serving a diverse range of customers. As a VCA partner, Avnet ASIC integrates design enablement within TSMC’s Open Innovation Platform® (OIP), offering services at each link in the IC value chain, including IP development, design, backend, wafer manufacturing, assembly, and testing.

“Our longstanding 20 years partnership and collaboration with TSMC is a testament to our unwavering commitment to innovation and excellence. This further solidifies our position in the industry enabling us to bring competitive advantage to our mutual customers by securing faster time to market and safe path to mass production”, said Yulia Milshtein, GM, Head of Business at Avnet ASIC Israel.

Pavel Vilk, GM, Head of Engineering, added, “With a rich track of record of numerous first time successful design projects in all process nodes down to the cutting-edge 4nm, showcasing a profound understanding of TSMC’s offerings, we are further amplifying our services in domains like AI, Automotive, HPC, Data Centers and more and we are ready to support our mutual customers addressing these state of the art applications”.