Broadcom Introduced Turnkey Designs for 3G Smartphones

12 December, 2012

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced three new turnkey solutions that enable OEMs to expedite production of 3G smartphones while lowering development costs.  For more news, visit Broadcom’s Newsroom.The new platforms are powered by HSPA and HSPA+ processors that have been proven on multiple carrier networks globally and include popular hardware components and software applications that have been tested and accepted by regional operator requirements.  By refining the platforms to account for device variations and pre-qualifying hardware component vendors, Broadcom offers multiple customization options and reduces the time to market. This allows handset manufacturers to focus on developing value-added features and affordably deliver a quality Android experience, across multiple smartphone product tiers, in approximately three months or less.As consumer demand for versatile features like touchscreen functionality, Wi-Fi and location-based services grows, the shift from 2G feature phones to more sophisticated 3G smartphones has accelerated.  Analyst firm Ovum predicts that 1.7 billion smartphones will ship by 2017 and cites turnkey solutions by chipset and platform providers as a key factor in helping handset manufacturers meet market demand for entry-level smartphones.1

Broadcom’s turnkey solutions are optimized to provide native support for the rich and immersive experience of the Android 4.0 Ice Cream Sandwich and the Android 4.1/4.2 Jelly Bean operating systems (OSs).  Powerful graphics and application processing capabilities enable OEMs to deliver a high-end multimedia experience in an entry-level device, while integration with Broadcom’s rich suite of wireless connectivity technologies, including Miracast and NFC, ensures consumers can take advantage of today’s most innovative applications.

Key Features:

  • BCM21654G 1GHz ARM Cortex A9 based HSPA 720p video
  • BCM21664T 1.2GHz Dual ARM Cortex A9 based HSPA+ 1080p video
  • BCM28145/155 1.2GHz Double-Dual ARM A9 HSPA+ 1080p video

Availability

All three platforms are currently sampling to early access partners, with volume production expected in December. For ongoing news, visit Broadcom’s Newsroom, read the B-Connected Blog, or visit Facebook or Twitter. And to stay connected, subscribe to Broadcom’s RSS Feed.

About BroadcomBroadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments.  With the industry’s broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®.  For more information, go to www.broadcom.com.

Contacts

Press Investors
Lydia Chan Chris Zegarelli
Manager, Public Relations (MWG) Senior Director, Investor Relations
415-623-9909 949-926-7567
[email protected]

PR Newswire (http://s.tt/1vNkh)

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