Above: Gilad Rozen, President & CEO of Celeno. Photo: Techtime
Renesas Electronics Corporation has announced the successful completion of the acquisition of Celeno for approximately US$315 million. Headquartered in Israel, Celeno offers a wide range of wireless communication solutions, including advanced Wi-Fi chipsets and software solutions. Among them the industry’s most compact chipset for Wi-Fi 6 and 6E. The deal will significantly enhance the connectivity portfolio of Renesas.
The company explained that Celeno’s technologies, combined with Renesas’ offering of MCU/MPU/SoC processors, wireless ICs, sensors and power management technologies, creates a comprehensive, end-to-end connectivity solutions for IoT, infrastructure, industrial and automotive applications.
Hidetoshi Shibata, President and CEO of Renesas, said: “Building on our recently-expanded connectivity portfolio following the Dialog acquisition, the addition of Celeno provides us with more advanced Wi-Fi connectivity capabilities. Renesas is now strongly positioned to capitalize on the growing opportunities from the massive rise in connectivity and requirements created by increasingly connected world.”
Techtime has learned that the new Celeno-centered design center will develop connectivity solutions for the Automotive industry, including V2X chips. Celeno was established in 2005 by the President & CEO Gilad Rozen. It received US$140 Million investments from high profile bodies such as Cisco, Samsung and major VCs. Its main competitors are Qualcomm, Broadcom and Mediatek. Most of its 170 employees are located in Israel. During 2020 Celeno shipped 15 million chips to costumers, for total sales of US$37 Million.